SURFACE MOUNT MILLIMETER-WAVE DIE PACKAGE WITH INDUSTRY LEADING HIGH-FREQUENCY PERFORMANCE.
Our packages offer unmatched low loss and low parasitic signal handling from MMIC to PCBs
Key Features
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Less than 0.2 dB Insertion Loss 1-70GHz.
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Fully shielded coax transmission lines enable ultra-broadband performance.
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All copper construction minimizes thermal resistance.
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Single and Multi-Die designs, with built in isolation and cavity mode suppression.
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In package passive functions can be utilized such as couplers and combiner.
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Turnkey Packaging Service Offered.
Lid Options
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Flat or Stepped
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Solder or Epoxy Lid Seal
TESTING RESULTS
Environmental test results are for PolyStrata technology only
| Moisture Sensitivity | PASS - IPC / J-STD-020E, MSL1, 168Hrs., 85C/85RH, 3x solder reflow |
| Humidity Accelerated Life Test (unbiased) | PASS – JESD22-A118B, 130°C, 85% RH, 96 Hrs. |
| Temperature Cycling/Shock | PASS - JESD22-A104E, Cond. B, -55°C to 125°C, 700 cycles |
| Mechanical Shock | PASS - JESD22-B104C, Cond. B, 1500g, 0.5 ms, 6 orientations, 5 shocks/orientation, 30 shocks total |
| Vibration, Variable Freq. | PASS - JESD22-B103B.01, Cond. 1, 20 G, 20 - 2000 Hz, 4 sweeps/axis, 4 min./sweep |
| Wire Bondable | Yes, up to 6hrs @ 150C or 12mins @ 260C (air), Argon Plasma clean, prior to bonding. |
| Recommended Storage Conditions Prior to wire bonding + lid seal | Storage in Nitrogen Environment. Similar to IMS board storage |