High power handling surface mount form factor package with industry leading low parasitics and cavity mode suppression
Key Features:
- Solid copper package body results in optimal thermal performance
- Compatible with automated Au wire bonding
- PCB interface compatible with standard SMT processes
- High isolation between components
- High performance – 0.5 dB loss up to 80 GHz
| Part Number | Frequency (GHz) | Insertion Loss | Max Die Size in mm (X, Y, Z) | Package Size (X, Y, Z) in mm |
|---|---|---|---|---|
| PSP19B02S-PS | 21 | 0.2 dB | 2.1, 1.3, 0.08 | 6.34, 3.896, 0.7 |
| PSP32B02S-PS | 40 | 0.3 dB | 3.55, 5.965, 0.18 | 6.789, 10.390, 0.85 |
| Coming Soon | 80 | 0.5 dB | Various sizes (TBD) | Various sizes (TBD) |
